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sep.co.kr

:::에스이피:::

Heastsink and Metal Core. Heatsink and Metal Core. SEP's core technology and advanced capabilities are driven by our focus on fabricating complex and cutting edge High Density Interconnect (HDI) PCB's. Package substrates offer mechanical base support and electrical connectivity between IC chips and the PCB supporting circuitry and protection, heat dissipation, and signal and power distribution. Heatsink and Metal Core. Heavy copper can be used in a PCB for a variety of purposes, including high power dist...

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:::에스이피::: | sep.co.kr Reviews
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Heastsink and Metal Core. Heatsink and Metal Core. SEP's core technology and advanced capabilities are driven by our focus on fabricating complex and cutting edge High Density Interconnect (HDI) PCB's. Package substrates offer mechanical base support and electrical connectivity between IC chips and the PCB supporting circuitry and protection, heat dissipation, and signal and power distribution. Heatsink and Metal Core. Heavy copper can be used in a PCB for a variety of purposes, including high power dist...
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4 design
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7 vision
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:::에스이피::: | sep.co.kr Reviews

https://sep.co.kr

Heastsink and Metal Core. Heatsink and Metal Core. SEP's core technology and advanced capabilities are driven by our focus on fabricating complex and cutting edge High Density Interconnect (HDI) PCB's. Package substrates offer mechanical base support and electrical connectivity between IC chips and the PCB supporting circuitry and protection, heat dissipation, and signal and power distribution. Heatsink and Metal Core. Heavy copper can be used in a PCB for a variety of purposes, including high power dist...

INTERNAL PAGES

sep.co.kr sep.co.kr
1

:::에스이피:::

http://sep.co.kr/com03/pg08.php

Heastsink and Metal Core. Heatsink and Metal Core. SEP has considerable technical knowledge and 15 years manufacturing experience in the supply of complex microwave PTFE and mixed dielectric multilayer PCBs. From simple multilayer designs through to complex metal core PCBs, SEP can support the most demanding RF/Microwave requirements. Having X, Y and Z CTE matched to copper. FR4, PTFE, Ceramic. 0060mm / 0.060mm. Defense and Aerospace Electronics. Tel : 82-31-231-2228 Fax : 82-31-231-2229.

2

:::에스이피:::

http://sep.co.kr/com03/pg03.php

Heastsink and Metal Core. Heatsink and Metal Core. For over 10 years, SEP has been producing single to multilayer constructions of both Flexible and Rigid-Flexible circuits. We have a core flex circuit engineering team that supports the latest in customer concepts for this technology, bringing the toughest designs to market. Our capability focus is with fine line and space, HDI features, static and dynamic bending, and compact designs. Fine line and space. Single to multi-layer constructions.

3

:::에스이피:::

http://sep.co.kr/com01/pg01.php

Heastsink and Metal Core. HOME About us Vision. We envision ourselves to be the most trustworthy partner of all inventors and developers supporting with the cutting edge technology and full service manufacturing. We see beyond the customer's expectation and develop long term partnerships built on trust, integrity, and respect. Customer's success reflects our success. We maintain sustainable business solution lasting next decades by innovation, teamwork, and ownership.

4

:::에스이피:::

http://sep.co.kr/com03/pg05.php

Heastsink and Metal Core. Heatsink and Metal Core. SEP has an extensive background in producing technically advanced, high quality probe cards and tester interfaces. We have been supporting the Automatic Test Equipment (ATE) business for many years and custom test applications for device under test (DUT) and interface circuit boards. We have design engineers on staff with 20 years experience in this technology. Special know-how in design and probecard fabrication. And legacy blade cards.

5

:::에스이피:::

http://sep.co.kr/com03/pg07.php

Heastsink and Metal Core. Heatsink and Metal Core. HOME PCB Heavy Copper. Heavy copper can be used in a PCB for a variety of purposes, including high power distribution, heat dissipation, planar transformers, and power convertors. SEP has been building heavy copper circuit boards with traces and copper planes of up to 6 ounces for over 20 years. Our engineering team can work with you to review your design to make sure that they can be manufactured reliably. Excellent heat loss capability.

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http://www.torbellon.com/linecard.html

Component Distributors Inc. (CDI) is a value added distributor of electronic components providing Power, RF and Microwave, Sensors, Measurement and Controls, Wireless and LED lighting products. CDI delivers technical solutions that are easy to find and easy to buy, providing customers and supplier partners with design services, web commerce enablement and flexible supply chain solutions. Odessey Business Products is a Toronto-based packaging and print solutions company. They manage projects from conc...

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Производство и монтаж печатных плат

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Оборудование для печатных плат. Что нужно для заказа? Здесь вы можете ознакомиться с нашим сервисом, с возможностями нашего производства, со всем перечнем услуг, оказываемым нашей компанией по изготовлению и монтажу печатных плат. Монтаж осуществляют высококвалифицированные специалисты, производство оснащено самым современным и профессиональным оборудованием для выполнения любых видов монтажа. Платы для светодиодных светильников. Печатные платы с толстой медью. Монтаж безвыводных (SMD) компонентов.

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О компании СЕПкоРус

http://sepco.ru/about

Оборудование для печатных плат. Что нужно для заказа? Компания СЕПкоРус основана в 1989 году в Санкт-Петербурге. Мы являемся официальным партнером корейской компании SEP Co. Продукция компании используется во многих областях электронной промышленности, включая автомобилестроение, потребителей сетей и коммуникаций, телекоммуникации, аэрокосмическую и военную, медицинскую, компьютерную отрасли. Мы быстро подстраиваемся под нужды и потребности наших клиентов. Ул Курчатова, д. 10, офис 41.

enipub.com enipub.com

::: Enipub :::

http://www.enipub.com/submenu05_1.asp

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:::에스이피:::

Heastsink and Metal Core. Heatsink and Metal Core. SEP's core technology and advanced capabilities are driven by our focus on fabricating complex and cutting edge High Density Interconnect (HDI) PCB's. Package substrates offer mechanical base support and electrical connectivity between IC chips and the PCB supporting circuitry and protection, heat dissipation, and signal and power distribution. Heatsink and Metal Core. Heavy copper can be used in a PCB for a variety of purposes, including high power dist...

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