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Integrated Circuits Packaging

IC Development and Packaging. Pin 1 offers subcontract IC assembly and packaging services to the integrated circuits community, including but not limited to RFIC, MMIC, solar power, and opto-electronics. From small lot quick-turns to continual or recurrent assembly requirements for your standard devices, Pin 1 can assemble your device and bill of materials dependably and accurately. All process steps are performed in a Class 10000 clean room environment with ESD protection and static monitoring throughout.

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to●●●●●●●●●@gmail.com

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Tom Gosselin

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Integrated Circuits Packaging | pin1tech.com Reviews

<META> DESCRIPTION

IC Development and Packaging. Pin 1 offers subcontract IC assembly and packaging services to the integrated circuits community, including but not limited to RFIC, MMIC, solar power, and opto-electronics. From small lot quick-turns to continual or recurrent assembly requirements for your standard devices, Pin 1 can assemble your device and bill of materials dependably and accurately. All process steps are performed in a Class 10000 clean room environment with ESD protection and static monitoring throughout.

<META> KEYWORDS

1 IC

2 Assembly

3 Packaging

4 Integrated Circuits

5 DotNetNuke

6 DNN

7

8 coupons

9 reviews

10 scam

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Page content here

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about us,assembly capabilities,ic assembly applications,ic package services,assembly capability,dicing,die sort,optical inspection,device attach,curing,wirebond,sealing/encapsulation,branding,ic applications,quick turn prototyping,stacked die bonding

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Integrated Circuits Packaging | pin1tech.com Reviews

https://pin1tech.com

IC Development and Packaging. Pin 1 offers subcontract IC assembly and packaging services to the integrated circuits community, including but not limited to RFIC, MMIC, solar power, and opto-electronics. From small lot quick-turns to continual or recurrent assembly requirements for your standard devices, Pin 1 can assemble your device and bill of materials dependably and accurately. All process steps are performed in a Class 10000 clean room environment with ESD protection and static monitoring throughout.

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pin1tech.com

1

Quick Turn Prototyping

http://www.pin1tech.com/ICAssemblyApplications/QuickTurnPrototyping.aspx

Ceramic and Hermetic Package Assembly. Small Volume Contract Assembly. If you are pressed for time to deliver prototypes, mockups, or samples, our facility can put together a small lot size if devices quickly, economically and within your time frame. Using the standard process steps. Available, a rapid assembly process can be developed for your devices that will ensure the finished parts will be on their way back based on dead line requirements. Die attach – using snap cure epoxy.

2

Stacked Die Bonding

http://www.pin1tech.com/ICAssemblyApplications/StackedDieBonding.aspx

Ceramic and Hermetic Package Assembly. Small Volume Contract Assembly. As new device types continue to shrink in footprint size, there is a creative space-utilizing technique of stacking chips one on top of the other to maximize use of vertical air space. Through a multi-pass process, as many as 5 thin IC devices can be stacked and bonded to produce a completed custom product. Typical Stacked Die Assembly. Logo designed and created by Jeffery Smith: jasworks@mac.com. Website Solutions by E-Nor.

3

Dicing

http://www.pin1tech.com/assemblycapabilities/dicing.aspx

High speed singulation of wafers, ceramic substrate, plastic encapsulated devices. Using various dicing blade composite materials, complete separation and singulation of hard, brittle, metallic, polymer compositions is completed cleanly and quickly. The singulation process utilizes de-ionized H2O for ESD control. Logo designed and created by Jeffery Smith: jasworks@mac.com. Website Solutions by E-Nor.

4

Branding

http://www.pin1tech.com/assemblycapabilities/branding.aspx

Device branding is done using a high speed laser marking system. Each device is indelibly marked with it’s unique part number , logo, lot number and date code. Logo designed and created by Jeffery Smith: jasworks@mac.com. Website Solutions by E-Nor.

5

IC Package Services

http://www.pin1tech.com/ICPackageServices.aspx

Pin 1 will collaborate and assist with developing the best package fit for your integrated circuit or CPV solar engine. We can design/specify and build a few prototypes, up to small volume on-shore and then ramp high volume production overseas. Logo designed and created by Jeffery Smith: jasworks@mac.com. Website Solutions by E-Nor.

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Integrated Circuits Packaging

IC Development and Packaging. Pin 1 offers subcontract IC assembly and packaging services to the integrated circuits community, including but not limited to RFIC, MMIC, solar power, and opto-electronics. From small lot quick-turns to continual or recurrent assembly requirements for your standard devices, Pin 1 can assemble your device and bill of materials dependably and accurately. All process steps are performed in a Class 10000 clean room environment with ESD protection and static monitoring throughout.

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