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Semiconductor Equipment

In Front of Line (FOL) process, there are three main process. Die Prep, Die Attach and Wire Bonding. Monday, March 9, 2009. The Wire Bonder 3200 offers a 30 µm pitch process capability. With its increased Y bond range it copes with the widest range of substrates. The improved air bearing and the optimized bond head controller enhance the ultra fine pitch capabilities,. With unprecedented placement accuracy, over the entire bond range. A dual cartridge programmable heater further extends the operational a...

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Semiconductor Equipment | semequip.blogspot.com Reviews

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In Front of Line (FOL) process, there are three main process. Die Prep, Die Attach and Wire Bonding. Monday, March 9, 2009. The Wire Bonder 3200 offers a 30 µm pitch process capability. With its increased Y bond range it copes with the widest range of substrates. The improved air bearing and the optimized bond head controller enhance the ultra fine pitch capabilities,. With unprecedented placement accuracy, over the entire bond range. A dual cartridge programmable heater further extends the operational a...

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Semiconductor Equipment | semequip.blogspot.com Reviews

https://semequip.blogspot.com

In Front of Line (FOL) process, there are three main process. Die Prep, Die Attach and Wire Bonding. Monday, March 9, 2009. The Wire Bonder 3200 offers a 30 µm pitch process capability. With its increased Y bond range it copes with the widest range of substrates. The improved air bearing and the optimized bond head controller enhance the ultra fine pitch capabilities,. With unprecedented placement accuracy, over the entire bond range. A dual cartridge programmable heater further extends the operational a...

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semequip.blogspot.com

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Semiconductor Equipment: September 2007

http://semequip.blogspot.com/2007_09_01_archive.html

In Front of Line (FOL) process, there are three main process. Die Prep, Die Attach and Wire Bonding. Sunday, September 23, 2007. Saturday, September 15, 2007. WHAT IS FLIP CHIP? IBM introduced flip chip interconnection in the early sixties for their mainframe computers, and has continued to use flip chip since then. Delco Electronics developed flip chip for automotive applications in the seventies. Delphi Delco currently places over 300,000 flip chip die per day into automotive electronics. M...Worldwide...

2

Semiconductor Equipment: March 2009

http://semequip.blogspot.com/2009_03_01_archive.html

In Front of Line (FOL) process, there are three main process. Die Prep, Die Attach and Wire Bonding. Monday, March 9, 2009. The Wire Bonder 3200 offers a 30 µm pitch process capability. With its increased Y bond range it copes with the widest range of substrates. The improved air bearing and the optimized bond head controller enhance the ultra fine pitch capabilities,. With unprecedented placement accuracy, over the entire bond range. A dual cartridge programmable heater further extends the operational a...

3

Semiconductor Equipment: March 2007

http://semequip.blogspot.com/2007_03_01_archive.html

In Front of Line (FOL) process, there are three main process. Die Prep, Die Attach and Wire Bonding. Saturday, March 17, 2007. Fine Pitch Au Wire Bonding. Fine Pitch Au Wire Bonding. Fine pitch wire bonding for bonding high density die is measured in pitch. This is a pitch that every year gets a little smaller. The limiting factor on the Palomar Model 8000 is generally the capillary. The model 8000 can bond with as little as 4 grams of force! Model 8000 Wire Bonder. Wire = .6 mil (15 um) 99.99 Au.

4

Semiconductor Equipment: February 2007

http://semequip.blogspot.com/2007_02_01_archive.html

In Front of Line (FOL) process, there are three main process. Die Prep, Die Attach and Wire Bonding. Thursday, February 15, 2007. Stacked Packages Get Thinner. By John Baliga, Contributing Editor -. Document.write(get publication('Semiconductor International') ;. Semiconductor International, 11/1/2006. The micro contacts themselves are. There are two basic process flows, but they both start with a sheet of copper foil that can be up to 120 µm thick. A thin (1 µm) layer of nickel is plated on top, fol...

5

Semiconductor Equipment: November 2008

http://semequip.blogspot.com/2008_11_01_archive.html

In Front of Line (FOL) process, there are three main process. Die Prep, Die Attach and Wire Bonding. Saturday, November 1, 2008. Oerlikon Esec is one of the world′s leading suppliers of innovative wire bonding solutions. Owing to our many years of experience, we can satisfy a wide range of customer needs in terms of reliability, assembly productivity, excellent customer support and an excellent cost of ownership. Esec Wire Bonder 3200. In conventional wire bonder design, the bondhead is mounted on an ort...

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Semiconductor Packaging: November 2008

http://sempack.blogspot.com/2008_11_01_archive.html

The latest news and information on semiconductor packaging, including wafer-level packaging, chip-scale packaging, 3-D integration, lead-free solder/RoHS, stacked die/packages, wafer bumping, die bonding, wire bonding, and encapsulation. Saturday, November 1, 2008. Intel Maintains Microprocessor Momentum in Q3. The picture was slightly different at rival Advanced Micro Devices Inc. (AMD), with the company losing share on a year-over-year basis. In the third quarter of 2008, AMD accounted for 12&#...8220;...

sempack.blogspot.com

Semiconductor Packaging: September 2007

http://sempack.blogspot.com/2007_09_01_archive.html

The latest news and information on semiconductor packaging, including wafer-level packaging, chip-scale packaging, 3-D integration, lead-free solder/RoHS, stacked die/packages, wafer bumping, die bonding, wire bonding, and encapsulation. Sunday, September 23, 2007. To provide these necessary functions of interconnection, physical support, environmental protection and heat dissipation, the active device must be surrounded by or encased in a package. An illustrarion of this concept is presented in Figu...

sempack.blogspot.com

Semiconductor Packaging: Renesas Subsidiary Creates High-Temp QFN-Like Package

http://sempack.blogspot.com/2009/03/renesas-subsidiary-creates-high-temp.html

The latest news and information on semiconductor packaging, including wafer-level packaging, chip-scale packaging, 3-D integration, lead-free solder/RoHS, stacked die/packages, wafer bumping, die bonding, wire bonding, and encapsulation. Monday, March 9, 2009. Renesas Subsidiary Creates High-Temp QFN-Like Package. Kenji Tsuda, Asia Contributing Editor - Semiconductor International, 2/17/2009 7:27:00 AM. Renesas Northern Japan, a subsidiary of Renesas Technology Corp. Renesas provides three types of Pro&#...

sempack.blogspot.com

Semiconductor Packaging: February 2007

http://sempack.blogspot.com/2007_02_01_archive.html

The latest news and information on semiconductor packaging, including wafer-level packaging, chip-scale packaging, 3-D integration, lead-free solder/RoHS, stacked die/packages, wafer bumping, die bonding, wire bonding, and encapsulation. Monday, February 19, 2007. Semiconductor Packaging Goes Vertical. Stacked packaging gets more silicon in less space. Randy Frank, Contributing Editor - Design News, June 5, 2006. How PoP Stacks Up. The first PoP stack for cellphones went into production in October 2004&#...

sempack.blogspot.com

Semiconductor Packaging: March 2007

http://sempack.blogspot.com/2007_03_01_archive.html

The latest news and information on semiconductor packaging, including wafer-level packaging, chip-scale packaging, 3-D integration, lead-free solder/RoHS, stacked die/packages, wafer bumping, die bonding, wire bonding, and encapsulation. Saturday, March 17, 2007. Silicon on Insulator (SOI). Smart Cut - The wafer bonding method is used to form the BOX, but instead of lapping off excess semiconducor (which is wasteful) a layer of hydrogen is implanted to a depth specifying the desired active layer of semic...

sempack.blogspot.com

Semiconductor Packaging: June 2008

http://sempack.blogspot.com/2008_06_01_archive.html

The latest news and information on semiconductor packaging, including wafer-level packaging, chip-scale packaging, 3-D integration, lead-free solder/RoHS, stacked die/packages, wafer bumping, die bonding, wire bonding, and encapsulation. Saturday, June 28, 2008. Semiconductor Packaging Materials offers a variety of reel sizes. Different customers have different reeling requirements depending on the usage of the part, and the type of automated equipment being used. Larger reel sizes typically mean...Semic...

sempack.blogspot.com

Semiconductor Packaging: ASE Leads Gartner Packaging Market Share Ranking

http://sempack.blogspot.com/2009/03/ase-leads-gartner-packaging-market.html

The latest news and information on semiconductor packaging, including wafer-level packaging, chip-scale packaging, 3-D integration, lead-free solder/RoHS, stacked die/packages, wafer bumping, die bonding, wire bonding, and encapsulation. Monday, March 9, 2009. ASE Leads Gartner Packaging Market Share Ranking. Sally Cole Johnson, Contributing Editor - Semiconductor International, 2/25/2009 9:17:00 AM. Another big part of the trouble is that capital expenditures on equipment have dried up. “Compa...Rising ...

sempack.blogspot.com

Semiconductor Packaging: March 2009

http://sempack.blogspot.com/2009_03_01_archive.html

The latest news and information on semiconductor packaging, including wafer-level packaging, chip-scale packaging, 3-D integration, lead-free solder/RoHS, stacked die/packages, wafer bumping, die bonding, wire bonding, and encapsulation. Monday, March 9, 2009. Renesas Subsidiary Creates High-Temp QFN-Like Package. Kenji Tsuda, Asia Contributing Editor - Semiconductor International, 2/17/2009 7:27:00 AM. Renesas Northern Japan, a subsidiary of Renesas Technology Corp. Renesas provides three types of Pro&#...

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Semiconductor Equipment

In Front of Line (FOL) process, there are three main process. Die Prep, Die Attach and Wire Bonding. Monday, March 9, 2009. The Wire Bonder 3200 offers a 30 µm pitch process capability. With its increased Y bond range it copes with the widest range of substrates. The improved air bearing and the optimized bond head controller enhance the ultra fine pitch capabilities,. With unprecedented placement accuracy, over the entire bond range. A dual cartridge programmable heater further extends the operational a...

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