semlab.com
SEM Lab, Inc.Failure analysis, material characterization, and scanning electron microscopy (SEM) service.
http://www.semlab.com/
Failure analysis, material characterization, and scanning electron microscopy (SEM) service.
http://www.semlab.com/
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SEM Lab, Inc.
20219 ●●●●●●Pl. SE
Sno●●●ish , WA, 98290-9658
US
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SEM Lab, Inc.
SEM Lab, Inc.
20219 ●●●●●●Pl. SE
Sno●●●ish , WA, 98290-9658
US
View this contact
Eskimo North
Dinse, Robert
P.O. ●●●●●55816
Sho●●●ine , WA, 98155
US
View this contact
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SEM Lab, Inc. | semlab.com Reviews
https://semlab.com
Failure analysis, material characterization, and scanning electron microscopy (SEM) service.
semlab.com
Materials Analysis Examples
http://www.semlab.com/examples/materials/examples2.html
Email Us: info@semlab.com. Call Us: 425.335.4400. Intermetallics in Solder Joints. Failure Analysis of BGAs. FAILURE ANALYSIS OF LEDS. GOLD EMBRITTLEMENT OF SOLDER JOINTS. FAILURE ANALYSIS OF PCBAS. DIFFUSION BARRIER PLATING IN ELECTRONICS. IMAGES OF FAILURES IN MICROELECTRONIC PACKAGING. FOURIER TRANSFORM INFRARED (FTIR) ANALYSIS. Failure Analysis of Aluminum Electrolytic Capacitors. Click on image to enlarge). Particle contamination on paper. Fatigue striations on a fracture surface.
Electronic Component Failure Analysis
http://www.semlab.com/ecfa/electroniccomponentfa.html
Email Us: info@semlab.com. Call Us: 425.335.4400. Intermetallics in Solder Joints. Failure Analysis of BGAs. FAILURE ANALYSIS OF LEDS. GOLD EMBRITTLEMENT OF SOLDER JOINTS. FAILURE ANALYSIS OF PCBAS. DIFFUSION BARRIER PLATING IN ELECTRONICS. IMAGES OF FAILURES IN MICROELECTRONIC PACKAGING. FOURIER TRANSFORM INFRARED (FTIR) ANALYSIS. Failure Analysis of Aluminum Electrolytic Capacitors. Electronic Component Failure Analysis Service. We have made available a collection of documents.
Failure Analysis Service
http://www.semlab.com/fa/failure_analysis.html
Email Us: info@semlab.com. Call Us: 425.335.4400. Intermetallics in Solder Joints. Failure Analysis of BGAs. FAILURE ANALYSIS OF LEDS. GOLD EMBRITTLEMENT OF SOLDER JOINTS. FAILURE ANALYSIS OF PCBAS. DIFFUSION BARRIER PLATING IN ELECTRONICS. IMAGES OF FAILURES IN MICROELECTRONIC PACKAGING. FOURIER TRANSFORM INFRARED (FTIR) ANALYSIS. Failure Analysis of Aluminum Electrolytic Capacitors. Failure Analysis of Electronic Devices. Failure Analysis of Medical Devices. Failure Analysis of Ceramics and Plastics.
Materials Analysis Service
http://www.semlab.com/ma/characterization.html
Email Us: info@semlab.com. Call Us: 425.335.4400. Intermetallics in Solder Joints. Failure Analysis of BGAs. FAILURE ANALYSIS OF LEDS. GOLD EMBRITTLEMENT OF SOLDER JOINTS. FAILURE ANALYSIS OF PCBAS. DIFFUSION BARRIER PLATING IN ELECTRONICS. IMAGES OF FAILURES IN MICROELECTRONIC PACKAGING. FOURIER TRANSFORM INFRARED (FTIR) ANALYSIS. Failure Analysis of Aluminum Electrolytic Capacitors. Electronic Materials and Process Analysis. HDI micro-via quality evaluation. Particle contaminant on printer paper. Speci...
Images of Failures in Microelectronics Packaging
http://www.semlab.com/papers/imagesoffailuresinmicroelectronics.html
Email Us: info@semlab.com. Call Us: 425.335.4400. Intermetallics in Solder Joints. Failure Analysis of BGAs. FAILURE ANALYSIS OF LEDS. GOLD EMBRITTLEMENT OF SOLDER JOINTS. FAILURE ANALYSIS OF PCBAS. DIFFUSION BARRIER PLATING IN ELECTRONICS. IMAGES OF FAILURES IN MICROELECTRONIC PACKAGING. FOURIER TRANSFORM INFRARED (FTIR) ANALYSIS. Failure Analysis of Aluminum Electrolytic Capacitors. Images of Failures in Microelectronics Packaging. Images of Failures in Microelectronics Packaging (pdf file).
TOTAL PAGES IN THIS WEBSITE
20
Haibel Consulting LLC Links
http://www.haibelconsulting.com/links.html
Ready, Willing, and Haibel. Links to Recommended Help. Inventor of HALT and HASS. Http:/ www.hobbsengr.com. HALT and HASS Equipment. Http:/ www.cszIndustrial/Products/HALTHASSChambers.aspx. Let the experts do your HALT testing. Http:/ www.QualityTest.net. Http:/ www.semlab.com. Statistical Wizardry and Training. Powered by Network Solutions.
TOTAL LINKS TO THIS WEBSITE
4
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SEM Lab, Inc.
Email Us info@semlab.com. Call Us: 425.335.4400. Intermetallics in Solder Joints. Failure Analysis of BGAs. FAILURE ANALYSIS OF LEDS. GOLD EMBRITTLEMENT OF SOLDER JOINTS. FAILURE ANALYSIS OF PCBAS. DIFFUSION BARRIER PLATING IN ELECTRONICS. IMAGES OF FAILURES IN MICROELECTRONIC PACKAGING. FOURIER TRANSFORM INFRARED (FTIR) ANALYSIS. Failure Analysis of Aluminum Electrolytic Capacitors. Characterization and analysis of materials (metals, plastics, ceramics, glasses. Particle analysis and identification.
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Elcome to the official webpage for the George W. Burns Scanning Transmission Electron Microscopy (STEM) Lab at Ohio Wesleyan University. This site contains historical and current information about the lab, an SEM image database, and additional electron microscopy links. Phone: (800) 922-8953 or (740) 368-2000.
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