Deca Technologies is an electrical interconnect solutions provider offering wafer level chip scale packaging (WLCSP) services to the semiconductor industry
http://www.decatechnologies.com/
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Deca Technologies
7855 S●●●●●●r Pkwy
Te●●pe , AZ, 85284
US
View this contact
Deca Technologies
Deca Technologies
7855 S●●●●●●r Pkwy
Te●●pe , AZ, 85284
US
View this contact
Deca Technologies
Deca Technologies
7855 S●●●●●●r Pkwy
Te●●pe , AZ, 85284
US
View this contact
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NETWORK SOLUTIONS, LLC.
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Deca electronics interconnect & semiconductor packaging - Deca Technologies | decatechnologies.com Reviews
https://decatechnologies.com
Deca Technologies is an electrical interconnect solutions provider offering wafer level chip scale packaging (WLCSP) services to the semiconductor industry
decatechnologies.com
Deca Papers - Deca
http://www.decatechnologies.com/papers
Wafer-Level Chip Scale Packaging. Fan-Out Wafer Level Packaging. All materials Deca Technologies 2016.
Deca Board of Directors - Deca Technologies
http://www.decatechnologies.com/board-of-directors
Wafer-Level Chip Scale Packaging. Fan-Out Wafer Level Packaging. Dana Nazarian - Chairman of the Board. Steve Hanson - Director. Tim Olson - Director. Joe Rauschmayer - Director. Minh Pham - Director. All materials Deca Technologies 2016.
Deca RSS Subscription - Deca
http://www.decatechnologies.com/rss-subscription
Wafer-Level Chip Scale Packaging. Fan-Out Wafer Level Packaging. Deca in the News. All materials Deca Technologies 2016.
Deca M-Series™ CSP: A Beginner’s Guide - Deca
http://www.decatechnologies.com/m-series
Wafer-Level Chip Scale Packaging. Fan-Out Wafer Level Packaging. M-Series CSP: A Beginner’s Guide. Deca’s M-Series CSP is a rugged, fully molded fan-out, wafer-level chip-scale package (WLCSP) technology. That provides high reliability ideally suited for mobile applications. M-Series CSP features Adaptive Patterning. A dynamic design and patterning process that resolves the issues associated with shifting die within an embedded device structure. What is Fan-out Wafer-Level Technology? Fan-out wafer-level...
Deca Deca in the News - Deca
http://www.decatechnologies.com/deca-in-the-news
Wafer-Level Chip Scale Packaging. Fan-Out Wafer Level Packaging. Deca in the News - FEATURED STORY. September 2, 2014. Chip Scale Review – The interconnect foundry: a new manufacturing paradigm for WLP. February 14, 2013. Semiconductor Packaging News: Viewpoint, Tim Olson. Deca in the news. August 5, 2016. FO-WLP Steals the Show at ECTC. July 1, 2016. Solid State Technology China – Enhancing Fan-in Wafer-Level Package Reliability. January 14, 2016. January 9, 2016. March 27, 2014. January 30, 2014.
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craigjb
http://craigjb.com/resume
Developed patented Adaptive Patterning software technology including proprietary routing and design tools for fan-out wafer-level packaging (FOWLP). Optimized design and routing software for massively parallel execution, load-balanced across multiple servers with multiple redundancy. Developed electronic design automation (EDA) support tools for integrating package design tools and data from different vendors. Developed two iPhone apps published in iTunes App Store:. Keystone Dental Abutment Wizard.
IWLPC - International Wafer Level Packaging Conference
http://www.iwlpc.com/call_for_papers.cfm
Bridging the Interconnect Gap. October 18 - 20, 2016. San Jose, California, USA. International Wafer-Level Packaging Conference. The SMTA and Chip Scale Review. Are pleased to announce plans for the 13th Annual International Wafer-Level Packaging Conference and Tabletop Exhibition. This premier industry event explores leading-edge design, material, and process technologies being applied to Wafer-Level Packaging applications. There will be special emphasis on the numerous device and end product ap...New M...
ECTC | IEEE Electronic Components and Technology Conference
http://www.ectc.net/sponsors/index.cfm
IEEE Electronic Components and Technology Conference. Intel Best Student Paper. Student Reception and Best Student Interactive Presentation. For more information contact:. Intel Best Student Paper. Student Reception and Best Student Interactive Presentation. About ECTC with Video.
ASU Research Park | Property Map
http://asuresearchpark.com/property-map
Amenities and Park Life. Build to Suit Opportunities. 8555 South River Parkway. 7700 South River Parkway. Applied Microarrays, Inc. Arizona State University Solar Power Lab. 8700 South Price Road. Bright Horizons Family Solutions, Inc. 7660 South Research Drive. 7855 South River Parkway. Titan Formwork Systems, LLC. 2055 East Technology Circle. 8620-8640 South River Parkway. Edward Jones Training Center. 8333 South River Parkway. 2150 East Warner Road. 2005 East Technology Circle. 8440 South River Parkway.
Sponsors | IWLPC - International Wafer Level Packaging Conference
http://www.iwlpc.com/sponsors.cfm
Bridging the Interconnect Gap. October 18 - 20, 2016. San Jose, California, USA. We couldn't have an event this good without the dedication and support of our sponsors and exhibitors. If you would like to see your company listed on this page, sign up to become a sponsor. Applied Materials is the global leader in providing innovative equipment, services and software to the semiconductor, flat panel display and solar photovoltaic industries. SUSS MicroTec is a leading supplier of equipment and process solu...
IWLPC - International Wafer Level Packaging Conference
http://www.iwlpc.com/exhibitor_info.cfm
Bridging the Interconnect Gap. October 18 - 20, 2016. San Jose, California, USA. Sponsor or Exhibit Today! View available Sponsorship and Exhibitor Opportunities. Dates: October 18-19, 2016. Location: DoubleTree by Hilton Hotel, San Jose, CA. October 19: 9:30am-3:30 pm. Why Exhibit at IWLPC? A focused international audience. In this highly competitive marketplace. And concepts to the market. With existing customers and generate new leads. View the latest floor plan. Two Free Lunches Per Day. 8' D x 10' W).
IWLPC - International Wafer Level Packaging Conference
http://www.iwlpc.com/expo.cfm
Bridging the Interconnect Gap. October 18 - 20, 2016. San Jose, California, USA. Exhibition: October 18-19, 2016. DoubleTree by Hilton Hotel, San Jose, CA. October 19: 9:30am-5:30 pm. AI Technology, Inc. Applied Materials, Inc. ASM LASER SEPARATION INTERNATIONAL. Carl Zeiss Microscopy, LLC. Conductive Containers, Inc. Cyber technologies USA, LLC. FlipChip International - Huatian. Grinding and Dicing Services Inc. Hitachi Chemical Co., Ltd. Lintec of America, Inc. Nikon Metrology, Inc. SHENMAO America, Inc.
Hotel and Travel Accommodations | IWLPC - International Wafer Level Packaging Conference
http://www.iwlpc.com/accommodations.cfm
Bridging the Interconnect Gap. October 18 - 20, 2016. San Jose, California, USA. Hotel and Travel Accommodations. DoubleTree by Hilton San Jose. Places you in the center of it all less than a half-mile from San Jose International Airport, 45 minutes from San Francisco International Airport (SFO), and an hour south of San Francisco and north of Monterey/Carmel. Incredibly close to both Santa Clara University and San Jose State University, our hotel is a great place to stay for visiting families and friends.
IWLPC - International Wafer Level Packaging Conference
http://www.iwlpc.com/index.cfm
Bridging the Interconnect Gap. October 18 - 20, 2016. San Jose, California, USA. And Chip Scale Review. Are pleased to announce the 13th Annual International Wafer-Level Packaging Conference and Tabletop Exhibition. IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging and manufacturing. Program Finalized and Registration Now Open! View the Conference brochure (PDF) for details. October 18, 2016.
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Decatec - Guida All'acquisto degli Elettrodomestici per la Casa e Cucina
Tritatutto e Mini Frullatori. Tostapane De’Longhi CTE2303.GR: Recensione e Guida all’Acquisto. De'Longhi CTE2303.GR Tostapane, Pinze e Scalda Brioches, Verde. Dotato di 2 pinze. Vedi Offerta su Amazon. Sei alla ricerca di un tostapane utile, pratico da usare per poter sempre preparare gustose colazioni in famiglia. Se non vuoi spendere troppo, ma al tempo stesso cerchi un prodotto funzionale e affidabile potrai affidarti a questo De’Longhi. Vanta una potenza di 550 W. Dovrai montare la griglia sopra le d...
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Decatec Performance and Design on autovarusteluun ja autojen modifiointeihin erikoistunut yritys, jonka toimitila sijaitsee Vantaalla, Koivuhaassa. Palveluihimme kuuluvat autosähkövarustelutyöt, auton ikkunoiden kalvotukset, autojen muutossuunnittelut, moottorien tehonlisäykset ja auton valojen parantaminen. Olemme erikoistuneet Xenon-valojen asennuksiin ja huoltoihin sekä erikoishälytinratkaisuihin. Soittele ja kysy lisää arkisin klo 9–17!
Nieuws - DECATECH AIR SYSTEMS
Heating & Cooling. By DECATECH AIR SYSTEMS. Tel: 32 (0)2/688.21.34 fax: 32 (0)2/687.59.99. Vriendschapsstraat 2 B-3090 Overijse. Enkele Krantz referentie projecten staan op de website. Momenteel zijn we bezig om onze producten pagina aan te maken zodat je heel ons gamma kan raadplegen via onze website. Het nieuwe jaar brengt een nieuwe website! Momenteel zijn we hard aan het werk om met het nieuwe jaar ook meteen onze vernieuwde website te lanceren. Kom dus regelmatig terug ….
Sean's Blog
Debugging is twice as hard as writing the code in the first place. Therefore, if you write the code as cleverly as possible, you are, by definition, not smart enough to debug it. Install dotnet core linux : How to install .Net Core on Ubuntu. February 18, 2018. Install dotnet core linux Install .NET Core for Ubuntu 14.04, Ubuntu 16.04, Ubuntu 16.10 and Linux Mint 17, Linux Mint. Securing Webapi using Json Web Token (JWT) in C#. January 22, 2018. When to choose Microsoft .NET Core? November 23, 2017.
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Deca electronics interconnect & semiconductor packaging - Deca Technologies
Wafer-Level Chip Scale Packaging. Fan-Out Wafer Level Packaging. Deca Technologies is an emerging wafer-level interconnect foundry built upon 10X thinking; the philosophy of striving to achieve exponential improvements over typical industry methods. Deca’s unique approach to design, equipment, processes and operational methods delivers our customers a competitive edge with short cycle time and rapid new product introduction. Deca Technologies’ M-Series Technology Wins Device of the Year. Breaking through...
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