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The world–renowned leading provider of micro module assembly and thick film and thin film substrate foundry services - Tong Hsing.. Our strategic plan is to provide state-of-the-art microelectronic packaging and substrate technologies to various industries, such as wireless communications, MEMS, image sensors, optical electronics, high brightness LED, solar cell, fuel cell, automotive electronics, military, computer peripherals, medical and network equipment.

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时时彩代理电话 | fh088.us Reviews
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The world–renowned leading provider of micro module assembly and thick film and thin film substrate foundry services - Tong Hsing.. Our strategic plan is to provide state-of-the-art microelectronic packaging and substrate technologies to various industries, such as wireless communications, MEMS, image sensors, optical electronics, high brightness LED, solar cell, fuel cell, automotive electronics, military, computer peripherals, medical and network equipment.
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1 DBC
2 CMOS Image Sensor
3 Image Sensor
4 BSI wafer
5 SiP
6 MEMS assembling and test
7 Power Module
8 Microwave Module
9 RF module
10 and DPC on AlN for Thermoelectric Module
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language »,english,中文 繁體,中文 简体,时时彩代理电话,management,technology,quality management,corporate social responsibility,award,branch,video,stakeholder engagement,available substrate technologies,assembly packaging services,rf testing,news,investors,application
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时时彩代理电话 | fh088.us Reviews

https://fh088.us

The world–renowned leading provider of micro module assembly and thick film and thin film substrate foundry services - Tong Hsing.. Our strategic plan is to provide state-of-the-art microelectronic packaging and substrate technologies to various industries, such as wireless communications, MEMS, image sensors, optical electronics, high brightness LED, solar cell, fuel cell, automotive electronics, military, computer peripherals, medical and network equipment.

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Substrate Manufacturing Services Direct Bonded Copper(DBC). Substrate Manufacturing Services Direct Plated Copper(DPC). Substrate Manufacturing Services - Thick Film Substrate. Available Microelectronic Packaging Technologies. Backend Technology and Others. Microelectronic / Image Sensor Assembly. DPC / DBC substrate. Welcome to Tong Hsing Electronic Industries, Ltd. The world renowned leading provider of micro module assembly and thick film and thin film substrate foundry services - Tong Hsing. VCSEL, C...

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