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Gail Flower Writes 4UAn Insider's Look at the Electronics Industry
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Gail Flower Writes 4U | gailflower.blogspot.com Reviews
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An Insider's Look at the Electronics Industry
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Gail Flower Writes 4U: 3D TSV packaging news from Alchimer
http://gailflower.blogspot.com/2009/02/3d-tsv-packaging-news-from-alchimer.html
Gail Flower Writes 4U. An Insider's Look at the Electronics Industry. Friday, February 6, 2009. 3D TSV packaging news from Alchimer. Now for some packaging news that’s even inspiring. At SEMICON West 2009, Alchimer, a Massy, France company, will launch their third product: AquiVia, a process used for wet deposition of the insulation and barrier layers inside high-aspect ratio TSVs. AquiVia eliminates dry process techniques from TSV metallization. Subscribe to: Post Comments (Atom). Wi-Fi DAQ devices can ...
Gail Flower Writes 4U: PCBs from equipment to materials to flex circuits
http://gailflower.blogspot.com/2009/02/pcbs-from-equipment-to-materials-to.html
Gail Flower Writes 4U. An Insider's Look at the Electronics Industry. Thursday, February 5, 2009. PCBs from equipment to materials to flex circuits. Then the Board side chimes in. Aqueous Technologies acquired Austin American Technology’s MicroJet family of conveyorized inline defluxing systems – a smart move to increase their capability. February 11, 2010 at 1:29 PM. Unfortunately, the deal fell apart for specific reasons. Aqueous Technologies is no longer affiliated with AAT in any way. National Instru...
Gail Flower Writes 4U: The Big Guys: Intel, Freescale and everyone else
http://gailflower.blogspot.com/2009/02/big-guys-intel-freescale-and-everyone.html
Gail Flower Writes 4U. An Insider's Look at the Electronics Industry. Wednesday, February 4, 2009. The Big Guys: Intel, Freescale and everyone else. It has been a busy couple of weeks at my desk collecting things in the electronics industry. Let’s review what everyone is talking about. Subscribe to: Post Comments (Atom). A professional journalist who covers the electronics packaging, SMT board-level, and solar industries. View my complete profile. May 5 -7, SMT and Packaging, Nuremberg, Germany. The vide...
Gail Flower Writes 4U: GT Solar reflects on US government support of solar industry
http://gailflower.blogspot.com/2009/02/gt-solar-reflects-on-us-government.html
Gail Flower Writes 4U. An Insider's Look at the Electronics Industry. Saturday, February 7, 2009. GT Solar reflects on US government support of solar industry. And then there’s solar power. GT Solar of Merrimack, NH, my home town had to cut down a few jobs when orders slowed their delivery dates. They haven’t had anyone cut their order yet, just slow it down. What’s needed to grow the renewable energy market in the U.S? Subscribe to: Post Comments (Atom). View my complete profile. Wi-Fi DAQ devices can s...
Gail Flower Writes 4U: No one can predict the recovery
http://gailflower.blogspot.com/2009/04/no-one-can-predict-recovery.html
Gail Flower Writes 4U. An Insider's Look at the Electronics Industry. Wednesday, April 8, 2009. No one can predict the recovery. Though everyone can put a number on how much the semiconductor industry is down, even Intel Corp, www.intel.com. The world’s largest chipmaker, and cannot predict exactly when the industry will revive. Last week the Semiconductor Industry Association www.sia-online.org. This week the WSTS (World Semiconductor Trade Statistics) organization www.wsts.org. This week when asked to ...
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francoisevontrapp.blogspot.com
Françoise in 3D: 6/7/09 - 6/14/09
http://francoisevontrapp.blogspot.com/2009_06_07_archive.html
Following the course of 3D IC integration and 3D Packaging. Wednesday, June 10, 2009. Filled vs. conformal vias: the consensus. Dr Zhang, I think we have reached a verdict. Bob Patti wrote in to confirm Anonymous Caller’s statement regarding polymer-filled, copper-lined TSVs, and also provided some additional data to support his comments. I’ve taken the liberty of paraphrasing his comments here:. See slides 29-30, the CIS pictured is from Oki.). Posted by Francoise von Trapp. Tuesday, June 9, 2009. Altho...
francoisevontrapp.blogspot.com
Françoise in 3D: 6/14/09 - 6/21/09
http://francoisevontrapp.blogspot.com/2009_06_14_archive.html
Following the course of 3D IC integration and 3D Packaging. Friday, June 19, 2009. Are you an oldtimer or a newcomer? It has nothing to do with age, and everything to do with whether you have the ability to embrace new and exciting things, or whether you deem them unworthy of your time. So which are you, an Oldtimer or a Newcomer? Posted by Francoise von Trapp. Thursday, June 18, 2009. 3D is hot at SEMICON West. Will feature a technical session,. The 3D TSV Revolution, It’s More Than Just Stacking! With ...
francoisevontrapp.blogspot.com
Françoise in 3D: 6/21/09 - 6/28/09
http://francoisevontrapp.blogspot.com/2009_06_21_archive.html
Following the course of 3D IC integration and 3D Packaging. Friday, June 26, 2009. SUSS MicroTec: A 3D Approach. It’s been a few years since I toured the US headquarters of SUSS MicroTec in Waterbury VT, so when general manager, Wilfried Bair invited me out to see their latest toolset developed with 3D integration processes in mind, and get the scoop on the company’s new temporary bonding and debonding system, I jumped at the chance. Until the recently announced agreement with 3M. The 3M process,. Labels...
francoisevontrapp.blogspot.com
Françoise in 3D: 7/5/09 - 7/12/09
http://francoisevontrapp.blogspot.com/2009_07_05_archive.html
Following the course of 3D IC integration and 3D Packaging. Monday, July 6, 2009. Today, July 6, 2009, is the day a vision becomes a reality. When I first started Françoise in 3D. Consider becoming a sponsor. To celebrate this launch, we will post the logos of the first 10 organizations who post comments in their associated topic center for the duration of SEMICON West. Finally, I'd like to welcome Leo to this space as a fellow blogger in 3D integration trends. Be sure to read Transistions - Part 1.
francoisevontrapp.blogspot.com
Françoise in 3D: 5/31/09 - 6/7/09
http://francoisevontrapp.blogspot.com/2009_05_31_archive.html
Following the course of 3D IC integration and 3D Packaging. Friday, June 5, 2009. News from IMEC’s technology forum. Other announcements from the technology forum were in the area of photovoltaics research with Schott Solar, brain research, and spectrum sensing capabilities for cognitive radios. Details can be found here on IMEC’s website. 8211; F.v.T. Posted by Francoise von Trapp. Tuesday, June 2, 2009. What’s your semi lingo IQ? Jeanne Beacham, of Delphon, and I started joking in the buffet line at th...
francoisevontrapp.blogspot.com
Françoise in 3D: Are you an oldtimer or a newcomer?
http://francoisevontrapp.blogspot.com/2009/06/are-you-and-oldtimer-or-newcomer.html
Following the course of 3D IC integration and 3D Packaging. Friday, June 19, 2009. Are you an oldtimer or a newcomer? It has nothing to do with age, and everything to do with whether you have the ability to embrace new and exciting things, or whether you deem them unworthy of your time. So which are you, an Oldtimer or a Newcomer? Posted by Francoise von Trapp. June 24, 2009 at 9:47 AM. June 25, 2009 at 12:15 PM. Subscribe to: Post Comments (Atom). Add Francoise in 3D to Your Network. Copper film metrolo...
francoisevontrapp.blogspot.com
Françoise in 3D: 5/24/09 - 5/31/09
http://francoisevontrapp.blogspot.com/2009_05_24_archive.html
Following the course of 3D IC integration and 3D Packaging. Friday, May 29, 2009. News in 3D: the plot thickens at ECTC. Gossip flies at industry events. But usually as soon as someone tells me something juicy, they follow up with “but you can’t write about that yet.” Do you realize how hard that is? When, WHEN can I tell? Additionally, at SEMICON West this year, Alchimer will launch the full AquiVia line. Posted by Francoise von Trapp. Thursday, May 28, 2009. Live from San Diego, it’s ECTC 2009. Chiarul...
francoisevontrapp.blogspot.com
Françoise in 3D: 3D processes and approaches: stepping stones to market adoption
http://francoisevontrapp.blogspot.com/2009/06/3d-processes-and-approaches-stepping.html
Following the course of 3D IC integration and 3D Packaging. Monday, June 22, 2009. 3D processes and approaches: stepping stones to market adoption. At the risk of oversimplification, I offer up the following analysis; perhaps the best way to understand how 3D integration using TSV will ultimately come together is to see it as a progression – a stepping stone approach. Even though that’s how the questions are often posed – it’s not likely to end up as an either-or situation. Posted by Francoise von Trapp.
francoisevontrapp.blogspot.com
Françoise in 3D: NEXX Systems: Going Strong in Tough Times
http://francoisevontrapp.blogspot.com/2009/03/nexx-systems-going-strong-in-tough.html
Following the course of 3D IC integration and 3D Packaging. Friday, March 6, 2009. NEXX Systems: Going Strong in Tough Times. View slide show of my visit to NEXX. NEXX has always seen the benefits of collaboration. For smaller companies in a big pond, it helps to level the playing field and leverage know-how. Senior project manager, Mark Welsh, talked to me about current collaborations with SEMATECH’s 3D Interconnect program. And IMEC's Industrial Affiliation Program (IIAP) on 3D integration. And there&#...
francoisevontrapp.blogspot.com
Françoise in 3D: 3D companies address critical areas
http://francoisevontrapp.blogspot.com/2009/06/3d-companies-address-critical-areas.html
Following the course of 3D IC integration and 3D Packaging. Tuesday, June 23, 2009. 3D companies address critical areas. It’s only Tuesday, and already, it’s been a productive week for 3D news. Yesterday, SUSS and 3M announced an agreement. Today, Alchimer SA, made a three-fold announcement. Lastly, DEK international stepped into the 3D arena. Posted by Francoise von Trapp. Barrier and seed layer. Subscribe to: Post Comments (Atom). Add Francoise in 3D to Your Network. Subscribe To Françoise in 3D. NEXX ...
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Gail Flower Writes 4U
Gail Flower Writes 4U. An Insider's Look at the Electronics Industry. Wednesday, April 8, 2009. No one can predict the recovery. Though everyone can put a number on how much the semiconductor industry is down, even Intel Corp, www.intel.com. The world’s largest chipmaker, and cannot predict exactly when the industry will revive. Last week the Semiconductor Industry Association www.sia-online.org. This week the WSTS (World Semiconductor Trade Statistics) organization www.wsts.org. This week when asked to ...
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