IC packaging solutions for challenging environments. BGAs, flip chips, MEMs, EMI shielding product development and manufacturing. Consulting services are available for failure analysis of electronic packages, Testing, and Test development, and auditing manufacturing sites
http://www.ismatco.com/
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Nemat International, Inc.
Abbas Attarwala
3070 O●●●●●● Court
Fr●●nt , California, 94539
United States
View this contact
Nemat International, Inc.
Abbas Attarwala
3070 O●●●●●● Court
Fr●●nt , California, 94539
United States
View this contact
Nemat International, Inc.
Abbas Attarwala
3070 O●●●●●● Court
Fr●●nt , California, 94539
United States
View this contact
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Integrated Circuit (IC) electronic package development, consulting and manufacturing. Ball Grid Array (BGA), Flip chips, MEMs, EMI shielding, failure analysis and test development | ismatco.com Reviews
https://ismatco.com
IC packaging solutions for challenging environments. BGAs, flip chips, MEMs, EMI shielding product development and manufacturing. Consulting services are available for failure analysis of electronic packages, Testing, and Test development, and auditing manufacturing sites
ismatco.com
Patented IC electronic package substrate technology for Ball Grid Arrays (BGAs) Flip Chips EMI shielding MEMs and multiple functionality products
http://ismatco.com/products.htm
The electronic substrates can be modified to address:. Wire bondable and flip chip requirements. EMI / RF Issues. Constrained space requirements. For example, in cell phones. For example, ICs used in very hot and corrosive environments such as, under the hood automotive applications. New types of applications. Integrating multiple types of products such as ASICs and MEMs into a single electronic package.
Consulting services for Integrated circuit (IC) electronic package development and manufacturing. Ball grid array packages (BGAs), thermal management solutions, Flip Chips, MEMs, EMI shielding
http://ismatco.com/consulting_services.htm
Consulting Services are available in the following areas for electronic packages. New IC electronic package development. Test development for new products and applications.
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Integrated Circuit (IC) electronic package development, consulting and manufacturing. Ball Grid Array (BGA), Flip chips, MEMs, EMI shielding, failure analysis and test development
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Ismatec Industry Solutions GmbH
Ismatec Industry Solutions GmbH. Herzlich Willkommen auf der Webseite der Firma Ismatec Industry Solutions GmbH. Unser Unternehmen hat sich darauf spezialisiert, Ihnen in Zeiten von steigender Arbeitslosigkeit und Fachkräftemangel das Finden geeigneter Arbeitnehmer auf der Basis von Werks- und Zeitarbeit zu erleichtern. Ismatec Industry Solutions GmbH. Die Ziele unserer Kunden sind unsere Ziele! Offene, wertschätzende Partnerschaft. Sicheres and gesundes Arbeiten. Arbeitsplätze schaffen und sichern.
Ismatec Industry Solutions GmbH
Ismatec Industry Solutions GmbH. Herzlich Willkommen auf der Webseite der Firma Ismatec Industry Solutions GmbH. Unser Unternehmen hat sich darauf spezialisiert, Ihnen in Zeiten von steigender Arbeitslosigkeit und Fachkräftemangel das Finden geeigneter Arbeitnehmer auf der Basis von Werks- und Zeitarbeit zu erleichtern. Ismatec Industry Solutions GmbH. Die Ziele unserer Kunden sind unsere Ziele! Offene, wertschätzende Partnerschaft. Sicheres and gesundes Arbeiten. Arbeitsplätze schaffen und sichern.
Ismatec, manufacturer of tubing pumps, peristaltic pumps, piston pumps, gear pumps
Ismatec, manufacturer of tubing pumps, peristaltic pumps, piston pumps, gear pumps
