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Index Microelectronic Assembly Package Encapsulation Potting

M A Kapslingsteknik AB is specialized in advanced IC assembly, prototyping services and low volume production for semiconductor companies. Mold compound, microelectronic package, gold wire bonding, Flip Chip, Chip-on-Board, stacked die, Multi-Chip Modules, System-in-Package, BGA, MEMS Encapsulation and potting. Inkapsling elektronik

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M A Kapslingsteknik AB is specialized in advanced IC assembly, prototyping services and low volume production for semiconductor companies. Mold compound, microelectronic package, gold wire bonding, Flip Chip, Chip-on-Board, stacked die, Multi-Chip Modules, System-in-Package, BGA, MEMS Encapsulation and potting. Inkapsling elektronik
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Index Microelectronic Assembly Package Encapsulation Potting | mak.se Reviews

https://mak.se

M A Kapslingsteknik AB is specialized in advanced IC assembly, prototyping services and low volume production for semiconductor companies. Mold compound, microelectronic package, gold wire bonding, Flip Chip, Chip-on-Board, stacked die, Multi-Chip Modules, System-in-Package, BGA, MEMS Encapsulation and potting. Inkapsling elektronik

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MAK - Your ideal partner for microelectronic assembly,encapsulation and potting

http://www.mak.se/about.html

Long Au-wire on a PCB with 70 um pitch on the chip. A WLAN radio chip on a PCB based QFN substrate before molding. Demonstration of different wire length with 25 um Au wire. The longest wire is 7 000 um. Pitch on die is 90 um. About MAK / About MAK. Caption for the second image. Demonstration of high loops, 1500 um, and long, 25um, Au wires on a ceramic substrate.

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Index Microelectronic Assembly Package Encapsulation Potting

Interconnects and Packages Microelectronics. M A Kapslingsteknik AB is specialized in advanced IC assembly and prototyping services for semiconductor companies, enabling faster time to market for new devices. We have 70 years experience and e. We have now become the in northern Europe leading independent developer of advanced microelectronic encapsulation. We have done products for automotive, telecom, consumer, industrial, space and medical applications. With our hotlot-service, we can offer microelectr...

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