The ultrasonic soldering technology allows fluxfree softsoldering onto 'hard-to-solder materials' such as glass, aluminum, ceramics stainless steel etc.
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MBR ELECTRONICS GmbH
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MBR ELECTRONICS GmbH
MBR ELECTRONICS GmbH
JONA●●●●SE 8
W●D , ZURICH, 8636
CH
View this contact
MBR ELECTRONICS GmbH
MBR ELECTRONICS GmbH
JONA●●●●SE 8
W●D , ZURICH, 8636
CH
View this contact
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Ultrasonic Soldering Technology by MBR ELECTRONICS GmbH | sonicsolder.com Reviews
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The ultrasonic soldering technology allows fluxfree softsoldering onto 'hard-to-solder materials' such as glass, aluminum, ceramics stainless steel etc.
sonicsolder.com
List of solderable materials and substrates of the ultrasonic soldering technology
http://www.sonicsolder.com/list_of_solderable_materials/solderable_materials_gb.html
List of solderable materials. List of Solderable Materials and Substrates. Ultrasonic Soldering Technology together with the active solder alloy Cerasolzer enables to soft soldering on hart-. T o-solder and exotic substrates and metal oxides, flux free! Glass - Ceramic - Metallic Glasses - Precious Stones. Ceramics (Macor, Shapal-M, Zirconiumoyde. Silica, Silica glass. Metals - Metal Oxides. Aluminum (Al), Aluminum. Copper (Cu), Copper. Titanium (Ti), Titanium. Tungsten (W), Wolfram.
Fields of applications of MBR ultrasonic soldering systems
http://www.sonicsolder.com/fields_of_applications/applications_gb.html
List of solderable materials. In production, research and development laboratories. Ceramic thick- and thin-film substrates. List of solderable materials.
Product Overview of MBR Ultrasonic Soldering Systems USS-series
http://www.sonicsolder.com/products/products_gb.html
List of solderable materials. USS-9210 Ultrasonic Soldering System. For small area applications. Laboratory equipment e.g. for hand operated equipment. 5 - 15W Ultrasonic soldering output. Soldering tips diameter 1.0 - 5.0 mm. USS-9510 Ultrasonic Soldering System. For big area applications. Laboratory equipment e.g. for hand operated equipment. 9 - 30W Ultrasonic soldering output. Soldering tips diameter 6.0 - 12.0 mm. Customised tips up to 30.0 mm dimension). USS-1908 Ultrasonic Soldering System.
Ultraschall Löt-Technologie der MBR ELECTRONICS GmbH
http://www.sonicsolder.com/default_de.htm
Löten mit Ultraschall ist anders. Flussmittelfrei. Korrosionsfrei. Diese Weichlöt-Technologie ermöglicht es, direkt auf 'schwer lötbare' Metalle und auch nicht-metallische Substrate zu benetzen, wie zum Beispiel Glas, Keramik, Aluminium, Stahl, Silizium, Metalloxyde etc. - FLUSSMITTELFREI! Das Löten / Benetzen findet unter normaler Atmosphäre statt. Beim 'Ultrasonic Caviation Phenomenon' werden oxydierte Oberflächen auf einfache Art gereinigt und Oxydschichten entfernt - und zwar ohne Flussmittel!
Accessories for Ultrasonic Soldering Systems
http://www.sonicsolder.com/assistive_tools/assistive_tools_gb.html
List of solderable materials. Different applications do require different handling and different tools to simplify and/or speeding up technical and operating processes. MBR ELECTRONICS offers consulting for solution determination of customised assignment of tasks. Please contact us for additional information. Furthermore, MBR provide a selection of tools which - over the years of experience - have proved helpful. These are C. Massive heat conductive materials have to be bonded.
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Weiter Links der MBR International Gruppe
http://www.technoscope.ch/links/links_de.html
Besuchen Sie weitere Webseiten der MBR INTERNATIONAL AG Gruppe:. Haupt-Seite mit dem gesamten Portfolio. Spezielle Aktiv-Lote für Lötungen auch im Niedertemperatur-Bereich. MBR Handel- und Vertrieb GmbH.
Links
http://www.cerasolzer.com/links/links_gb.html
List of solderable materials. Please visit the websites of the other divisions of the MBR INTERNATIONAL AG group:. Main Website with complete portfolio. Optical systems for special applications. MBR Handel- und Vertrieb GmbH. List of solderable materials.
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Ultrasonic Soldering Technology by MBR ELECTRONICS GmbH
List of solderable materials. ULTRASONIC SOLDERING is different. Fluxfree. Corrosionfree. This soft soldering technology enables direct wetting on ‘hard-to-solder’ metals and also non-metallic (exotic). Substrates like glass, ceramics, steel, silicon, aluminum, metal oxides - FLUXFREE! The wetting process simply takes place under normal atmosphere. Using 'ultrasonic cavitational phenomenon' the oxidised layers on the surface are simply removed and cleaned. This means that the use of any.
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