visionics.blogspot.com

Visionics

Thursday, 30 July 2015. Is a tool that aids the designer integrate bare die or chips into their projects. AsPacker automates the process eliminating errors that can be made during hand editing a package layout.The Wire Bond Explorer. Allows the packaging engineer to parametrically design the fan out pattern for a die. This tool also has a 3D Viewer. Allowing the designer to see the design from all angles. Cross referencing between the netlist and die is also available. Outputs in clued DXF format.

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Thursday, 30 July 2015. Is a tool that aids the designer integrate bare die or chips into their projects. AsPacker automates the process eliminating errors that can be made during hand editing a package layout.The Wire Bond Explorer. Allows the packaging engineer to parametrically design the fan out pattern for a die. This tool also has a 3D Viewer. Allowing the designer to see the design from all angles. Cross referencing between the netlist and die is also available. Outputs in clued DXF format.

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Visionics | visionics.blogspot.com Reviews

https://visionics.blogspot.com

Thursday, 30 July 2015. Is a tool that aids the designer integrate bare die or chips into their projects. AsPacker automates the process eliminating errors that can be made during hand editing a package layout.The Wire Bond Explorer. Allows the packaging engineer to parametrically design the fan out pattern for a die. This tool also has a 3D Viewer. Allowing the designer to see the design from all angles. Cross referencing between the netlist and die is also available. Outputs in clued DXF format.

INTERNAL PAGES

visionics.blogspot.com

1

Visionics: July 2015

http://www.visionics.blogspot.com/2015_07_01_archive.html

Thursday, 30 July 2015. Is a tool that aids the designer integrate bare die or chips into their projects. AsPacker automates the process eliminating errors that can be made during hand editing a package layout.The Wire Bond Explorer. Allows the packaging engineer to parametrically design the fan out pattern for a die. This tool also has a 3D Viewer. Allowing the designer to see the design from all angles. Cross referencing between the netlist and die is also available. Outputs in clued DXF format. How to...

2

Visionics: VLSI Design

http://www.visionics.blogspot.com/p/vhdl.html

Some main features of EDWinXP VHDL Editor are :. It compiles the source file and generates wirelist (*.wrs) output file. The output file (*.wrs) may be imported directly into EDWinXP. Generates simulatable models in Mixed Mode and EDSpice Model Generators. Converts the (*.wrs) file to Xilinx,CUPL and JEDEC formats. Subscribe to: Posts (Atom). EDWinXP 2.10 Version Released! View my complete profile. Simple template. Powered by Blogger.

3

Visionics: July 2013

http://www.visionics.blogspot.com/2013_07_01_archive.html

Monday, 29 July 2013. Wi-Fi for Gesture Recognition. Researchers at the University of Washington have found a way to detect and recognise human gestures based on how they affect Wi-Fi signals. The technology, dubbed WiSee, could enable multiple users to control home appliances such as light switches and music players, with a simple wave of the hand. To know more click on the link below. Http:/ www.youtube.com/watch? Subscribe to: Posts (Atom). Wi-Fi for Gesture RecognitionResearchers at the Un.

4

Visionics: Wirebonding in EDWinNET

http://www.visionics.blogspot.com/2015/07/wirebonding-in-edwinnet.html

Thursday, 30 July 2015. Is a tool that aids the designer integrate bare die or chips into their projects. AsPacker automates the process eliminating errors that can be made during hand editing a package layout.The Wire Bond Explorer. Allows the packaging engineer to parametrically design the fan out pattern for a die. This tool also has a 3D Viewer. Allowing the designer to see the design from all angles. Cross referencing between the netlist and die is also available. Outputs in clued DXF format.

5

Visionics: SPICE

http://www.visionics.blogspot.com/p/spice.html

Procedure for creating schematic diagram and simulating it. Open EDWinXP from Start →Programs → EDWinXP - Main. Click on File → New project. For starting a new project. Invoke the Schematic editor by double clicking the Project → Page (Mainpage). Set the instance parameters for all components (component value). Place wave form markers / probes for viewing the output. Run simulation with suitable time step and time limit. Select the EDSPICE simulator from Preferences→ EDSpice simulator. It is possible to ...

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visionics.blogspot.com

Visionics

Thursday, 30 July 2015. Is a tool that aids the designer integrate bare die or chips into their projects. AsPacker automates the process eliminating errors that can be made during hand editing a package layout.The Wire Bond Explorer. Allows the packaging engineer to parametrically design the fan out pattern for a die. This tool also has a 3D Viewer. Allowing the designer to see the design from all angles. Cross referencing between the netlist and die is also available. Outputs in clued DXF format.

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